Project Announcement: Artificial Intelligence for Expedited Adhesive Formulation Development

The US Department of Defense is partnering with industry and academia on an initiative to use Al to create innovative epoxy adhesive formulations. Using Artificial Intelligence (AI) as a tool to support adhesive innovations can significantly increase conception of novel formulations. AI has been used in a variety of industries to take repetitive and time-consuming tasks, such as large data analysis, and has proven to be a viable technology that can propel this work forward in a way that significantly increases the ability to create new products.

This initiative will start with a base formulation of conventional bisphenol A-based epoxy resin and an amine-terminated curing agent and evaluate different combinations of molecular weights for the resins and curing ratios, including the curing agent, curing agent-to-resin mixed ratios, and different curing temperatures.

Key project objectives are:

  • Design, test, and evaluate key epoxy resins and correlating curing agents through a targeted AI review process.
  • Utilize various resin properties in machine learning environments for optimal evaluation and formulation outcomes.
  • Document and test identified promising formulations resulting from Al review.
  • Conduct further production simulations for further optimization through targeted Al review.

If you feel your organization has the technical capabilities and would like to be considered for this project, please complete the form below and upload your organization’s technical capabilities statement.

Interested Submissions Due by 8/22/2023.

We encourage participation of Disadvantaged Business Enterprises (DBEs), including Minority Business Enterprises (MBEs) and Women’s Business Enterprises (WBEs).