Track 3 – Electronics

Tuesday, April 19, 2005

1:30 pm  “Enhanced Wiring Integrity System”, Brian Cyrier, Eclypse International

1:55       “JCAA/JG-PP Lead-Free Solder Testing for High-Reliability Applications”, Brian Greene, ITB, Inc.

2:20      “Fault Wire Test”, Andrew Yang, NAVAIR Jacksonville

2:45       “ICA - Isotropically Conductive Adhesive”, Tom Tiano, Foster-Miller

Wednesday, April 20, 2005

8:00 am  “Advanced Manufacturing Technologies for Extending Microprocessor Availability”, Tabitha Stebbins, US Army AMCOM

8:35       “Test Solutions for the Future”, James Crosson, Huntron

9:00       “Long Term Supportable Solutions for ICs”, Harvey M. Hanson

SPAWAR Systems Center

9:25        “ATE Test Program Set Migration System”, Peter Hansen, Teradyne

9:50        Break

10:15      “ESD Mitigation through Detection", Lawrence Weber, Tobyhanna

10:40      “Static Event Detection Health Monitor”, Tom Odom, VCD

11:05       “Field Programmable Gate Array Depot Technology Initiative”, John Shawhan, Warner Robins Air Logistics Center

11:30      “Automated Test Equipment – Synthetic Instrumentation”, Chris Clendenin, Boeing